|Clamping Force Range|
|Max Allowed Diameter|
|Operating Temperature |
|GC140-4T_F||35-50||140||127||47 - 107||-30...+230|
Bar clamps are used to assemble high power press-pack (hockey puk) semiconductors, i.e. diodes and thyristors, with suitable heatsinks in order to dissipate the thermal power generated inside the devices during operations and avoiding overtemperature in silicon junctions. Bar clamps are designed to apply the force needed to assure proper electrical and thermal contact between high power semiconductors and heatsinks.
Green Power Solutions offers a wide selection of bar clamps, i.e. Bar clamp F and Bar clamp R respectively with flat or round pressure heads, with clamping force spanning from 5 kN to 110 kN and accepting press-pack devices with flange diameters up to 163 mm.
GBXX, GB52, GB59, GB80